Flip chip package module and method of forming the same
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United States of America Patent
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Oct 28, 2003
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N/A
app pub date -
Sep 25, 2002
filing date -
Jul 9, 2002
priority date (Note) -
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Abstract
A flip-chip package module consists of a semiconductor chip, a heat sink plate, a dielectric layer and a metal interconnect layer. The semiconductor chip has a positive side with a plurality of die pads located thereon and a back side for mounting onto the heat sink plate. The dielectric layer is formed by depositing on the surface of the inner heat sink plate and encases the semiconductor chip therein. The metal interconnect layer is formed on the surface of the dielectric layer and includes a plurality of metal conductive wires. Each of the metal conductive wires connects to one of the die pads of the semiconductor chip through a via.
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