High power radiation emitter device and heat dissipating package for electronic components
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United States of America Patent
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Oct 28, 2003
Grant Date -
Oct 17, 2002
app pub date -
Apr 13, 2001
filing date -
Jan 31, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; and at least one electrical conductor electrically coupled to the electronic component and extending out of said sealed chamber. The electronic component(s) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.
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