Apparatus and method for the placement and bonding of a die on a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 4, 2003
Grant Date -
N/A
app pub date -
Jul 18, 2000
filing date -
Jul 18, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.
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