Electrical solder ball contact
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United States of America Patent
Stats
-
Nov 4, 2003
Grant Date -
Dec 12, 2002
app pub date -
Jun 7, 2001
filing date -
Jun 7, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An electrical contact including a contact end having a gold-plated surface for receiving a solder ball and edge surfaces adjacent to the gold surface for containing the solder ball on the gold-plated surface. In one embodiment, the contact end is connected to a curved lead and a portion of the contact end adjacent to the curved lead is comprised a less solder-wettable material than gold. A method of fabricating the electrical contact includes plating a metal sheet with a gold stripe and stamping the sheet to provide the contact surface in the gold stripe. Also described is an electrical connector having a plurality of conductive contacts, each having a gold-coated surface for receiving a solder ball and less solder-wettable edge surfaces adjacent to the gold surface.
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