Integrated process for depositing layer of high-K dielectric with in-situ control of K value and thickness of high-K dielectric layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 4, 2003
Grant Date -
N/A
app pub date -
May 15, 2002
filing date -
May 15, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus and a method of depositing a dielectric material film, including steps of initiating a process of depositing a dielectric material film under at least one controllable initial condition in an apparatus comprising a dielectric material deposition chamber and a spectroscopic ellipsometer; and measuring, by the spectroscopic ellipsometer, at least one ellipsometric parameter of the dielectric material film during the process of depositing the film.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully