Apparatus for cleaning semiconductor wafers in a vacuum environment
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United States of America Patent
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-
Nov 11, 2003
Grant Date -
Jul 18, 2002
app pub date -
Mar 16, 2001
filing date -
Jan 16, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A dry cleaning device, wherein a pad is moved towards a surface of a wafer, cleaning gas is injected into a space formed between the pad and the wafer to generate a high-speed gas flow along the surface of the wafer whereby particles left on the surface of the wafer are removed with the high-speed gas flow. In addition, in order to assist this physical cleaning action, either a chemical or an electrical cleaning method such as a plasma additionally may be used.
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