Processes for manufacturing flexible wiring boards
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United States of America Patent
Stats
-
Nov 11, 2003
Grant Date -
N/A
app pub date -
Feb 28, 2001
filing date -
Jul 29, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps (16) using a mask film patterned by photolithography. Fine openings are formed in a polyimide film with good precision allowing fine metal bumps (16) to be formed with good precision. After metal bumps (16) have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps (16).
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