Solder reflow with microwave energy
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 11, 2003
Issued Date -
N/A
app pub date -
Dec 28, 2001
filing date -
Dec 28, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully