Lead frame and method for fabricating resin-encapsulated semiconductor device
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United States of America Patent
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Nov 11, 2003
Grant Date -
Jan 2, 2003
app pub date -
Dec 11, 2001
filing date -
Jun 27, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
The lead frame of the present invention is a lead frame used in resin encapsulation of a semiconductor chip using an encapsulation mold that includes a die cavity to be filled with an encapsulation resin, the lead frame including: a first region exposed to the die cavity; a second region that is surrounding the first region and to be clamped by the encapsulation mold; a third region exposed to an ambient air with the die cavity being filled with the encapsulation resin; and at least one groove formed on a surface of the lead frame that is opposite to another surface of the lead frame on which the first region is present, the at least one groove extending from an area corresponding to the first region across another area corresponding to the second region so as to reach the third region.
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