Treating solution applying method
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United States of America Patent
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-
Nov 11, 2003
Grant Date -
N/A
app pub date -
Dec 31, 2002
filing date -
Jun 10, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate spinning step is executed for spinning a substrate in a plane parallel to a principal plane thereof at a first spinning speed of 100 rpm to 500 rpm. Then, a first applying step is executed for supplying a treating solution to a surface of the substrate by moving a nozzle from a position opposed to an edge of the substrate in a spin toward a position opposed to a spin center of the substrate while delivering the treating solution from the nozzle. Next, a second applying step is executed for supplying the treating solution to the surface of the substrate by stopping the nozzle at the position opposed to the spin center of the substrate in the spin while delivering the treating solution from the nozzle. Finally, a film thickness adjusting step is executed for stopping delivery of the treating solution from the nozzle, and spinning the substrate in the plane parallel to the principal plane thereof at a second spinning speed faster than the first spinning speed.
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