High performance EMI shield for electronic equipment
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United States of America Patent
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Nov 11, 2003
Grant Date -
N/A
app pub date -
May 2, 2000
filing date -
May 2, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to an electronic module which has a honeycomb material held within a solid metal frame as the top and bottom of the module. This structure provides increased capacity for convective cooling and increased electromagnetic radiation shielding over previous options.
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