Semiconductor module having interconnected semiconductor chips disposed one above the other
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United States of America Patent
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Nov 11, 2003
Grant Date -
N/A
app pub date -
May 22, 2000
filing date -
May 21, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor module has a plurality of semiconductor chips which are provide on chip carriers in a housing. At least some of the semiconductor chips are disposed one above the other and there are conductive connections between the chip carriers of the semiconductor chips disposed one above the other. The conductive connections are formed by plug-in connections and extend through openings in the chip carriers. The openings may be lined with a conductive layer. In an alternative embodiment intermediate layers are provided between the semiconductor chips disposed one above the other. The intermediate layers have conductive projections which engage in the openings in the chip carriers for forming conductive connections.
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