Flexible tape carrier with external terminals formed on interposers
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United States of America Patent
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-
Nov 11, 2003
Grant Date -
Dec 5, 2002
app pub date -
Jul 19, 2002
filing date -
Oct 20, 1999
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In order to provide a semiconductor apparatus in which both semiconductor chips and interposers are provided on a carrier tape, electrical properties can be improved using short wiring in a wiring pattern substantially symmetric with respect to the semiconductor chips, production can become easier, and compactness and heat radiation can be improved. Semiconductor chips electrically connected to wiring formed on the carrier tape, and interposers on the carrier tape and surrounding the semiconductor chips, are provided next to each other.
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