Apparatus for forming coaxial silicon interconnects
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United States of America Patent
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Nov 11, 2003
Issued Date -
N/A
app pub date -
Aug 14, 2002
filing date -
Dec 2, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An interconnect apparatus for testing bare semiconductor dice comprises raised contact members on a semiconductive substrate. The contact members are covered with an insulation layer and a conductive cap connected by a conductive trace to a testing circuit. The trace is covered with coaxial layers of a silicon-containing insulation and a metal for shielding the trace from 'crosstalk' and other interference. An apparatus for simultaneous testing of multiple dies on a wafer has thermal expansion characteristics matching those of the semiconductor die or wafer and provides clean signals.
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