Spray evaporative cooling system and method
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United States of America Patent
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-
Nov 11, 2003
Grant Date -
Nov 21, 2002
app pub date -
May 16, 2001
filing date -
May 16, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.
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