Lead-free solder alloy powder paste use in PCB production
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United States of America Patent
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Nov 18, 2003
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app pub date -
Feb 9, 2001
filing date -
Feb 16, 1999
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Abstract
Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in the form of an alloy paste with a low melting alloy utilised in powder form, in particular a Bi-containing alloy.
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