Thin film composite containing a nickel-coated copper substrate and energy storage device containing the same
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United States of America Patent
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-
Nov 18, 2003
Grant Date -
Dec 26, 2002
app pub date -
Jun 25, 2001
filing date -
Jun 27, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a process of preparing a copper/nickel substrate by annealing nickel-coated copper. After the nickel deposition step, a dielectric, such as lead zirconate titanate (PZT), may be deposited onto the substrate by methods known in the art such as sol-gel or vacuum deposition. This invention further relates to thin film composites. These composites include a pre-annealed nickel-coated copper substrate and a dielectric such as PZT.
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