Stackable ceramic fbga for high thermal applications

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6650007
APP PUB NO 20010048152A1
SERIAL NO

09924635

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Abstract

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An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

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Patent Owner(s)

Patent OwnerAddress
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT100 WALL STREET SUITE 1600 NEW YORK NY 10005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Corisis, David J Meridian, ID 329 8828
Kinsman, Larry D Boise, ID 209 5169
Mess, Leonard E Boise, ID 45 1420
Moden, Walter L Meridian, ID 194 4970

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