Method for mounting semiconductor element to circuit board
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United States of America Patent
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-
Nov 25, 2003
Grant Date -
N/A
app pub date -
Mar 20, 2000
filing date -
Oct 2, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a method for mounting a semiconductor element to a circuit board and a semiconductor device whereby connection reliability and connection strength in bonding of the semiconductor element and circuit board are enhanced and a connection resistance value is stabilized low. An insulating adhesive is applied to an opposite face of a circuit board. The circuit board is then connected with a semiconductor element by a conductive adhesive and the insulating adhesive which are interposed between an electrode on the circuit board and the projecting electrode and set in the same process. The circuit board and semiconductor element are connected by the insulating adhesive in addition to the conductive adhesive, so that connection reliability and connection strength are high and a connection resistance value is stabilized low.
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