Microelectronic joining processes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 25, 2003
Grant Date -
Mar 6, 2003
app pub date -
Mar 10, 2000
filing date -
Mar 10, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and then cooled, leaving said contacts on said microelectronic element bonded to said conductive features on the connection component. The connection component is maintained at an average temperature below the glass transition temperature of the polymer in the connection component during the heating and cooling steps.
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