Thermal expansion compensation for modular printhead assembly
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United States of America Patent
Stats
-
Nov 25, 2003
Grant Date -
Feb 27, 2003
app pub date -
May 6, 2002
filing date -
Mar 10, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printhead assembly (1) for an inkjet printer, the printhead assembly (1) including: a composite support member (3) for attachment to the printer, the composite support member (3) being formed of at least two materials (5, 6, 7) and having a unitary mounting element (5); a printhead (2) adapted for mounting to the mounting element (5); wherein, the materials (5, 6, 7) of the support member (3) are selected and structurally combined such that the coefficient of thermal expansion of the support member (3) is substantially equal to the coefficient of thermal expansion of the printhead (2). In the context of the present invention, 'the coefficient of thermal expansion of the support member' is a reference to the effective coefficient of thermal expansion of the mounting element taking into account any external influences from the rest of the support.
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