Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
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United States of America Patent
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-
Nov 25, 2003
Grant Date -
N/A
app pub date -
Feb 6, 2001
filing date -
Feb 6, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The chip includes a conductive pad and the support circuit includes a conductive trace. An elongated wire that electrically connects the pad to the trace is attached to the pad by a wire bond and attached to the trace by a plated connection joint. Preferably, an electrically conductive path between and in contact with the pad and the trace includes the elongated wire and excludes solder and conductive adhesive. A method of manufacturing the assembly includes forming the wire bond using thermocompression or thermosonic ball bonding and then forming the connection joint using electroless plating.
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