Solution to metal re-deposition during substrate planarization
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United States of America Patent
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Nov 25, 2003
Grant Date -
N/A
app pub date -
Jun 30, 2000
filing date -
Jun 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and composition for planarizing a substrate. The composition includes one or more surfactants, including one or more anionic surfactants, Zweitter-ionic surfactants, dispersers, or combinations thereof, one or more chelating agents, one or more oxidizers, one or more corrosion inhibitors, and deionized water. The composition may further comprise one or more agents to adjust the pH and/or abrasive particles. The method comprises planarizing a substrate using a composition including one or more surfactants of anionic surfactants, Zweitter-ionic surfactants, or combinations thereof.
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