Method for applying uniform pressurized film across wafer
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United States of America Patent
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Nov 25, 2003
Grant Date -
Aug 8, 2002
app pub date -
Mar 12, 2002
filing date -
Aug 29, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed resilient flexible material member contacting the wafer.
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