Substrate processing apparatus and substrate processing method

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United States of America Patent

PATENT NO 6656281
SERIAL NO

09589451

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Abstract

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A blast unit for sending air from the top of a processing chamber to the bottom thereof and an exhaust pipe for exhausting gas from the bottom of the processing chamber are provided. Concomitantly with a change in pressure in the processing chamber, intervals of a slit damper and/or the degree of opening of a damper is controlled by a controller and thus a blast amount or an exhaust amount is controlled, thereby maintaining the pressure in the processing chamber almost constant.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kudou, Hiroyuki Kikuchi-gun, JP 8 655
Ueda, Issei Kumamoto, JP 52 2179

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