Method of forming a stack of packaged memory dice
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United States of America Patent
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Dec 2, 2003
Issued Date -
N/A
app pub date -
May 24, 2002
filing date -
Mar 9, 1998
priority date (Note) -
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Abstract
A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry.
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