Method for laser drilling
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 2, 2003
Grant Date -
Mar 13, 2003
app pub date -
Jun 6, 2002
filing date -
Apr 11, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Drilling holes in structures using two different lasers allows a precise hole to be formed quickly. While one laser cuts a hole quickly, a second laser precisely shapes the hole. One useful application of such a method is drilling holes in multilayered structures such as Printed Wiring Boards (PWBs). One laser can precisely remove a first layer (copper) and a portion of a second layer (dielectric material). During this removal the shape of the hole is precisely formed. A second laser can remove the remaining portion of the second layer, exposing a third layer (copper). The use of the second laser can allow rapid removal of the remaining portion of the second layer. When cutting through a PWB, the second laser can be of a type that minimally damages the third copper layer.
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