Microelectronic assembly formation with lead displacement
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United States of America Patent
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Dec 2, 2003
Grant Date -
Jun 13, 2002
app pub date -
Sep 20, 2001
filing date -
Sep 21, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
Leads are connected between first and second elements so that a first end of each lead is connected to the first element and a second end of each lead is connected to the second element. and the elements are moved away from one another so as to bend the leads towards a vertically-extensive disposition. The direction of each lead, prior to the movement step, is represented by a lead direction vector from the first end of the lead to the second end of the same lead. At least some of these lead direction vectors are non-parallel with at least some other lead direction vectors, but the various lead direction vectors have components in a common direction. During the vertical movement step, the first element is moved in a horizontal direction of motion in this common direction, thereby moving the first end of each lead horizontally toward the second end of that lead, so as to provide or maintain slack in the leads.
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