Integrated circuit chip package having an internal lead
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 2, 2003
Grant Date -
N/A
app pub date -
Jul 18, 2001
filing date -
Jul 18, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A package for an integrated circuit chip is disclosed, along with structures and methods for making and mounting the package. An exemplary embodiment of the package includes a molded body having leads embedded therein with an aperture adjacent each of the leads. A portion of each lead that is internal to the periphery of the package body is exposed through the corresponding aperture. Electrical connection to the leads is made within the respective corresponding apertures.
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