Stacked radio-frequency module
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United States of America Patent
Stats
-
Dec 2, 2003
Grant Date -
Jul 3, 2003
app pub date -
May 24, 2002
filing date -
Dec 27, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A stacked radio-frequency module is formed by stacking packages each storing MMICs and mounting another package upside down which stores a control circuit for controlling MMICs. The MMICs and control circuits are each sealed by a metal sealing lid within the cavity of each of the packages which are spatially completely separated from each other. Each of the pads for wiring paths for radio-frequency signals and for power supply/control signals and ground pads are provided within each package and at opposing surfaces of packages to be stacked with corresponding pads joined by a gold bump.
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