Formation of an embedded capacitor plane using a thin dielectric
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United States of America Patent
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Dec 2, 2003
Grant Date -
N/A
app pub date -
Aug 24, 2000
filing date -
Aug 24, 2000
priority date (Note) -
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Abstract
A capacitor, which has a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.
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