High-performance memory module
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United States of America Patent
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Dec 2, 2003
Grant Date -
N/A
app pub date -
Oct 12, 2000
filing date -
Oct 12, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A high-performance memory module. The memory module is designed for a computer system with a wide data path. The memory module is implemented using a small printed circuit board (PCB), with a plurality of memory chips and a connector mounted upon the PCB. Signal traces for control, address, and data signals are arranged in such a manner as to minimize the length of each signal trace, thereby saving PCB area. On the connector, an electrical ground pin is located between each pair of signal pins, which may allow for a low-resistance return current path, and may therefore allow the module to operate at higher clock frequencies. Furthermore, locating a ground pin between each pair of signal pins may help reduce signal interference, or 'crosstalk', thereby improving signal integrity of the memory module.
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