Lid assembly for a processing system to facilitate sequential deposition techniques
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 9, 2003
Grant Date -
Sep 5, 2002
app pub date -
Mar 2, 2001
filing date -
Mar 2, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lid for a semiconductor system, an exemplary embodiment of which includes a support having opposed first and second opposed surfaces. A valve is coupled to the first surface. A baffle plate is mounted to the second surface. The valve is coupled to the support to direct a flow of fluid along a path in original direction and at an injection velocity. The baffle plate is disposed in the path to disperse the flow of fluid in a plane extending transversely to the original direction. In one embodiment the valve is mounted to a W-seal that is in turn mounted to the first surface of the support.
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