Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 9, 2003
Grant Date -
Jan 10, 2002
app pub date -
Jun 20, 2001
filing date -
Jul 7, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
There are provided an electrodeposited copper foil with carrier that can be used for manufacturing a printed wiring board that excels in the finished accuracy of the resistor circuit in comparison with a conventional printed wiring board with resistor circuits, and a method for manufacturing such a printed wiring board with resistor circuits. The method for manufacturing a printed wiring board with resistor circuits comprises the steps of previously forming copper foil circuits using a copper foil for a printed wiring board with resistor circuits comprising a nickel layer for forming a resistor circuit between a copper carrier and a copper foil layer for forming the circuit, whose surface layer is subjected to a nodular treatment, using a copper etching solution that does not etch the nickel layer; fabricating a copper clad laminate using the copper foil after forming the copper circuits, and a prepreg composing a resin base material; removing the copper carrier to expose the nickel layer for forming the resistor circuit, and etching the resistor circuits to form the nickel resistor-circuits.
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