Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 9, 2003
Issued Date -
N/A
app pub date -
May 24, 2001
filing date -
Aug 22, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The support circuit includes an insulative base and a conductive trace. The conductive trace includes a pillar and a routing line. An electrolessly plated contact terminal contacts the pillar, and an electrolessly connection joint contacts the routing line and the pad. A method of manufacturing the assembly includes simultaneously electrolessly plating the contact terminal and the connection joint.
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