Micromechanical and microoptomechanical structures with single crystal silicon exposure step
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United States of America Patent
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Dec 9, 2003
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N/A
app pub date -
Jul 11, 2002
filing date -
Nov 27, 2000
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Expired
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Abstract
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
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