Structure for backside saw cavity protection
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 9, 2003
Grant Date -
N/A
app pub date -
Jun 28, 2001
filing date -
Jun 28, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A structure includes holes formed in a layer of tape. The holes are aligned over active areas on chips formed in a wafer. A custom vacuum chuck with a plurality of suction ports is aligned on the tape such that the suction ports contact only the tape and not the hole portions. Flats of the custom vacuum chuck are formed so that a perimeter of the flats contacts, and rests on, the tape. In addition, the flats of the custom vacuum chuck are formed so that the flats cover the entire active area on the first surface of each of the chips. Consequently, the combination of the custom vacuum chuck and the single layer of tape form a protective cavity over the active areas of the chips during singulation from the wafer.
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