Single level microelectronic device package with an integral window
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 9, 2003
Issued Date -
N/A
app pub date -
Feb 25, 2002
filing date -
May 16, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.
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