Nickel alloy probe card frame laminate
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United States of America Patent
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-
Dec 9, 2003
Grant Date -
Aug 7, 2003
app pub date -
Jan 30, 2002
filing date -
Mar 6, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A probe head assembly for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer portion formed from a plurality of laminated metallic layers. The laminated metallic layers are formed from a low coefficient of thermal expansion metal, such as Invar, a 36% nickel--64% iron alloy. By orienting the metallic grains of the laminated metal layers to be off-set from the orientation of metallic grains of adjacent metallic foil layers, increased strength and flatness is achieved.
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