Structure and fabrication process for integrated moving-coil magnetic micro-actuator
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United States of America Patent
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Dec 9, 2003
Grant Date -
N/A
app pub date -
Sep 8, 2000
filing date -
Dec 14, 1999
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Abstract
A moving-coil magnetic microactuator is formed by using a dual silicon wafer structure and thin film technologies such as deep trench reactive ion etching, reactive ion etching, plasma-enhanced chemical vapor deposition and metallo-organinc chemical vapor deposition. Several bottom structures are formed from a bottom wafer, each bottom structure having a coil and wires embedded in the surface of the bottom structure. Several top structures are formed from a top wafer, each top structure having a magnet and mechanical stand-offs. The top structures are bonded to the bottom structures so that the magnet is above the embedded coil, separated by an air gap created by the mechanical stand-offs.
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