High capacity memory module with built-in performance enhancing features

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United States of America Patent

PATENT NO 6661690
APP PUB NO 20030156443A1
SERIAL NO

10077057

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Abstract

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A memory module with any combination of driver line terminators, power supply circuits, and components integral to a memory control subsystem mounted directly on the memory module for use with high speed, impedance-controlled memory buses. The memory module may be formed on a conventional printed circuit card with unpacked or packed memory chips attached directly to the memory module. Including the additional functionality directly on the memory modules improves the EMC/EMI performance as well as signal quality and integrity, thereby enhancing the memory subsystem performance. Such designs may also eliminate the need for bus exit connections, thereby allowing the freed-up connection capacity to be used to address additional memory capacity on the module. Another embodiment features a module with the additional features but without memory devices.

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Patent Owner(s)

Patent OwnerAddress
HIGH CONNECTION DENSITY INC1267 BORREGAS AVENUE SUNNYVALE CA 94089

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Dirk D Sunnyvale, CA 15 1490
Fan, Zineng Santa Clara, CA 1 11
Li, Che-Yu Ithaca, NY 54 1821
Moriarty, Sharon L Mountain View, CA 3 124

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