Importance

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Abstract

An optical module comprising: an optical element flip-chip mounted on a substrate; an optical waveguide formed on the substrate and optically connected to the optical element; and underfill resin filled in between the substrate and the optical element and covering an optical junction between the optical element and the optical waveguide, wherein the underfill resin is of an electrically insulating material and has a refractive index equal to or smaller than a refractive index of a clad portion of the optical waveguide. The optical element can be flip-chip mounted with improved mechanical and electrical mounting reliability and thus satisfactory optical connection can be maintained. Further, it never occurs that light passing through the optical waveguide leaks to the underfill resin in the optical junction between the optical waveguide and the optical element.

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First Claim