Importance

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Abstract

Embodiments of an apparatus and method for optical chip-to-chip signaling via free-space are disclosed herein. In one representative embodiment of a fiber-free interconnect system in accordance with the teachings of the present invention, a plurality of microchips packages, each including a microchip coupled to a carrier, may be mounted to a surface of a substrate. Each of the plurality of microchip packages may also include at least one optoelectronic microchip coupled to the carrier, and including an optical source and/or an optical detector to generate or detect optical signals, respectively, to facilitate communication between microchips. Each of the plurality of microchip packages may be mounted to the substrate to optically couple the at least one optoelectronic microchip to a corresponding micro-electro mechanical system mirror array to reflect the optical signals to the optical detector, or from the optical source, respectively.

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First Claim