Optoelectronic packaging assembly
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United States of America Patent
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Dec 16, 2003
Grant Date -
Mar 6, 2003
app pub date -
Aug 29, 2001
filing date -
Aug 29, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.
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