Surface mount attachable land grid array connector and method of forming same
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United States of America Patent
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-
Dec 16, 2003
Grant Date -
Aug 1, 2002
app pub date -
Jan 29, 2002
filing date -
Jan 31, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.
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