Method of making ball grid array package with deflectable interconnect
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United States of America Patent
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-
Dec 16, 2003
Grant Date -
May 15, 2003
app pub date -
Dec 18, 2002
filing date -
Jul 13, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is heated such that the solder reflows, the cantilever springs toward its non-deflected position and is at least partially absorbed by the reflowing solder.
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