Method and apparatus for increasing the material removal rate in laser machining
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United States of America Patent
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Dec 16, 2003
Grant Date -
Oct 2, 2003
app pub date -
Apr 10, 2002
filing date -
Dec 4, 2001
priority date (Note) -
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Abstract
Methods and apparatus for material modification using laser bursts including appropriately timed laser pulses to enhance material modification. In one implementation, a method for material modification comprises the steps of: providing bursts of laser pulses, wherein each burst comprises at least two laser pulses, wherein each laser pulse has a pulse duration within a range of between approximately 10 ps and 100 ns, wherein a time between each laser pulse of each burst is within a range of between approximately 5 ns and 5 .mu.s; a time between successive bursts is greater than the time between each laser pulse comprising each burst; and directing the bursts upon a workpiece, wherein an intensity of a primary laser pulse of each burst exceeds a damage threshold of the workpiece.
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