Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 16, 2003
Grant Date -
Nov 29, 2001
app pub date -
Jun 29, 1999
filing date -
Jun 29, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit die and/or package. An apparatus is described having a substrate with a central region and an outer region. A first plurality of electrical connections is spaced apart by a first distance on the outer region of the substrate. A second plurality of electrical connections is spaced apart by a second distance, smaller than the first distance, on the central region of the substrate.
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