Semiconductor chip package with interconnect structure
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United States of America Patent
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Dec 16, 2003
Grant Date -
Jan 3, 2002
app pub date -
May 8, 2001
filing date -
May 8, 2000
priority date (Note) -
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Abstract
An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous closely-spaced interconnections. The assembly is provided with terminals movable with respect to the active element and interconnect element. The interconnect element desirably provides low-impedance conductive paths interconnecting active electronic devices within the active element.
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