Liquid etchant and method for roughening copper surface
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United States of America Patent
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Dec 23, 2003
Grant Date -
N/A
app pub date -
Jun 8, 1999
filing date -
Jun 9, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive pattern and an outer layer material during manufacturing of a printed circuit board, resulting in the manufacturing being highly simplified. The liquid etchant includes a main component containing an oxo acid such as sulfuric acid and a peroxide such as hydrogen peroxide. Also, the liquid etchant includes an auxiliary component containing a tetrazole such as 5-aminotetrazole or the like, or a 1,2,3-azole. The liquid etchant permits a copper surface to be roughened in an acicular manner.
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